We are preparing a cleaning process for PCBAs with the FSC-BT1036C module already mounted, and we could not find guidance in the datasheet regarding compatibility with post-assembly washing.
Could you please confirm the following:
- Is the module compatible with cleaning using isopropyl alcohol (IPA)?
- Is ultrasonic cleaning (typically 25-40 kHz) safe for the module, considering the internal crystal and RF shielding? If so, are there recommended limits on exposure time and power?
- Have you received any failure reports from other customers related to ultrasonic cleaning after reflow/assembly?
We plan to process several hundred PCBAs and want to validate the cleaning method before running it at volume.
Thank you in advance for your help.